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CRefrecences

1. IPC J-STD-001D - Requirements for Soldered Electrical and Electronic Assemblies
   
   
2. IPC A-610D -Acceptability of Electronic Assemblies
   
   
3. Issues And Solutions To Implementing Lead Free Soldering by L. Whiteman. American Competitiveness Institute; SMTA Boston Conference; Boston, Massachusetts
   
   
4. Test Results From The Lead-Free Component Focus Group by L. Whiteman, American Competitiveness Institute, Philadelphia, Pa; M. Kwoka, Intersil, Palm Bay, Fl; J. Cannis, Amkor  Technology Inc., Chandler, Az; G. O’Brien, Photocircuits, Glen Cove, N. Y.; D. Hillman, Rockwell Collins, Cedar Rapids, Ia; M. Toben, Shipley Ronal, Freeport, N. Y.; R. Schetty, Technic, Inc., Freeport, NY; SMTA Boston Conference; Boston, Massachusetts, May, 2002
   
   
5. Guidelines for Lead Free Hand Soldering by L. Whiteman, American Competitiveness Institute, R. Northam, American Competitiveness Institute; Circuits Assembly Magazine;
   
   
6. Converting Wave Soldering Equipment From Tin Lead To Lead Free by L. Whiteman, American Competitiveness Institute, J. Stong, American Competitiveness Institute, D. Alavezos, Technical Devices Company; Circuits Assembly Magazine;
   
   
7. Assembly Of JCAA/JG-PP Test Vehicles by A. L. Campuzano-Contreras,BAE Systems, SMTA International Conference, Chicago, Illinois; September, 2005
   
   
8. Lead-Free Process Implementation Tactics by C. Shea, Cookson Electronics Assembly Materials Group
   
   
9. Lead-Free Wave Soldering: Tighter Process Windows Require Tighter Controls by C. Shea, Cookson Electronics Assembly Materials
   
   
10. Optimizing Stencil Design For Lead-Free SMT Processing by R. Pandher and C. Shea; Cookson Electronics Assembly Materials, SMTA International Conference, Chicago, Illinois; September, 2004

 

 

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